Linkcom Manufacturing Co., Ltd

 

March 16, 2026 — As the global surge in AI computing power drives exponential growth in data center electricity consumption, power electronics technology has taken center stage in the industry. A global leader in magnetic components and power solutions, LinkCom Manufacturing Co., Ltd. (TPE: 6821) today announced that it will showcase its 1.6 kW 4-phase buck power module and advanced Matrix Inductor technology, designed specifically for AI servers, at the 2026 Applied Power Electronics Conference.

Breaking Power Limits: Matrix Inductor Becomes Key to AI Power Delivery
In AI server and high-performance computing (HPC) architectures, AI chips often require instantaneous current bursts of thousands of amperes within microseconds. Traditional discrete inductor architectures can no longer simultaneously meet the three stringent requirements of ultra-fast transient response, low current ripple, and extreme miniaturization.

The 1.6 kW 4-phase buck architecture demonstrated by LinkCom features a key innovation: the integration of advanced Matrix Inductor technology. Through precise magnetic coupling design, magnetic flux between adjacent phases is effectively cancelled. This not only significantly reduces current ripple and core losses during steady-state operation, but also delivers exceptional power stability under extreme dynamic loads, providing strong power support for high-power computing units in the 1 MW rack era.

Expanding the Technology Gap: Simulation Software and Material Expertise Create Competitive Barriers
It is important to note that the Matrix Inductor is not a standard component that can be easily replicated. Instead, it is a highly customized engineering solution. Under demanding high-frequency and high-current conditions, its design requires advanced electromagnetic and thermal simulation software as well as deep expertise in magnetic material technology, far exceeding the requirements of conventional inductors.

Leveraging its strong R&D foundation and precise simulation capabilities, LinkCom can tailor optimal magnetic circuit and thermal designs for different AI chip power architectures. This significantly shortens system manufacturers’ trial-and-error cycles and development timelines, while establishing a clear technological advantage over traditional passive component manufacturers.

Building a Comprehensive High-End Product Portfolio
Even the smallest energy loss in the power conversion path can be greatly magnified in AI data centers. In addition to its core Matrix Inductor and multiphase power conversion technologies, LinkCom will also showcase a full lineup of high-end magnetic components at the conference, covering PoE, LAN, industrial inductors, and common-mode chokes (CMC).

From high-power energy transmission to signal integrity in high-speed networking, LinkCom is committed to delivering comprehensive, highly reliable system-level component solutions without performance bottlenecks.

Embracing Change to Create New AI Power Solutions
“In this era of transformation in power electronics, no company can succeed alone,” said Benson Wang, Product Manager at LinkCom. “Both resources and pressure are rapidly flowing into this industry. This is not only a test of technology, but also a reshaping of supply chain integration capabilities.”

Through the international platform of APEC 2026, LinkCom aims to demonstrate its years of technological expertise and strong market insight to leading global researchers. At the same time, the company sincerely invites chip manufacturers and system integrators seeking technological breakthroughs to collaborate.

Whether through joint development of next-generation AI server solutions or customized projects for specialized specifications, LinkCom is ready to work with industry partners to push the physical limits of energy efficiency together.