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May 29,2025 磁性元件
IR-Reflow Temperature Definition Announcement
•【About J-STD-020 reflow soldering temperature curve】
•Link Power Electronics magnetic component products comply with the reflow soldering conditions defined by JEDEC in J-STD-020.
•Mechanical/thermal stress levels should be considered based on mounting conditions such as solder type, solder amount, and circuit board design.
•Customers are requested to verify mounting conditions and performance based on actual circuit boards.
